添加en和zh
This commit is contained in:
132
en/docs/dev_doc/datasheet/modules/a316_1926_v1_datasheet.md
Normal file
132
en/docs/dev_doc/datasheet/modules/a316_1926_v1_datasheet.md
Normal file
@@ -0,0 +1,132 @@
|
||||
---
|
||||
title: A316-1926-V1 Specification Sheet for XU316 Module Specialized for USB HiFi Decoder
|
||||
---
|
||||
|
||||
# A316-1926-V1 Specification Sheet for XU316 Module Specialized for USB HiFi Decoder
|
||||
|
||||
--8<-- "common/phaten_xmos_support_img.md"
|
||||
|
||||
<div class="result" markdown>
|
||||
{align=right width=150}
|
||||
## 1. Product Introduction
|
||||
### 1.1 Product Description
|
||||
|
||||
- A316-1926V1 is a high-performance USB HiFi decoder-specific XU316 module based on XMOS XU316, designed for high-fidelity audio applications. The module integrates high-precision power management, 48.152MHz and 49.152MHz active crystals, and large-capacity storage, providing an ideal hardware platform for high-end audio applications.
|
||||
- A316-1926-V1 provides a USB Audio device compatible with full-speed and high-speed USB 2.0 interfaces, capable of supporting sampling rates up to 768 KHz in USB 2.0 asynchronous mode.
|
||||
</div>
|
||||
|
||||
### 1.2 Product Features
|
||||
|
||||
- **USB Interface Features**
|
||||
- USB 2.0 (Full-speed and High-speed)
|
||||
- USB Audio Class 1.0
|
||||
- USB Audio Class 2.0
|
||||
- USB Firmware Upgrade (DFU)
|
||||
|
||||
### 1.3 Product Diagram
|
||||
|
||||
<figure markdown="span">
|
||||
{width="600"}
|
||||
<figcaption></figcaption>
|
||||
</figure>
|
||||
|
||||
### 1.4 Specifications
|
||||
|
||||
| Specification Item | Description
|
||||
| :------------------------| :----------
|
||||
| Product Name | A316-1926-V1
|
||||
| Product Description | XU316 Module Specialized for USB HiFi Decoder
|
||||
| Core Chip |[XMOS XU316-1024-QF60B-C24](/assets/download/XMOS-XU316-1024-QF60B-C24.pdf)|
|
||||
| Clock |48.152MHz/49.152MHz Active Crystal Clock|
|
||||
| Package Type | SMT Stamp Hole
|
||||
| Environmental Statement | All hardware components fully comply with EU RoHS directive
|
||||
|
||||
### 1.5 Absolute Electrical Parameters
|
||||
| Parameter | Minimum | Maximum | Unit |
|
||||
|:-------------------------------------|:------:|:------:|:----:|
|
||||
| Storage Temperature | -40 | 125 | ℃ |
|
||||
| Supply Voltage | -0.5 | 3.63 | V |
|
||||
| ESD Voltage (Human Model) TAMB-25℃ | -2 | 2 | KV |
|
||||
| ESD Voltage (Machine Model) TAMB-25℃ | -500 | 500 | V |
|
||||
|
||||
|
||||
### 1.6 Normal Operating Conditions
|
||||
| Function | Minimum | Typical | Maximum | Unit |
|
||||
|:-------------|:------: |:------:|:------:|:----:|
|
||||
| Operating Temperature | 0 | - | 70 | ℃ |
|
||||
| Operating Voltage | 3 | 3.3 | 3.6 | V |
|
||||
|
||||
### 1.7 Operating Current
|
||||
|Operation State | Average | Peak | Unit |
|
||||
|:---------|:------:|:------:|:----:|
|
||||
| Active@3.3V | 120 | 200 | mA |
|
||||
|
||||
|
||||
## 2. Pin Definition
|
||||
|
||||
### 2.1 Pin Layout
|
||||
<figure markdown="span">
|
||||
{width=300}
|
||||
<figcaption></figcaption>
|
||||
</figure>
|
||||
|
||||
### 2.2 Pin Description
|
||||
| Module Pin Number | Name | Type | Function |
|
||||
| :------: | :------: | :------: | :------ |
|
||||
| 1 | GND | P | Module Ground |
|
||||
| 2 | 3V3 | P | Module 3.3V Power Supply |
|
||||
| 3 | X1D11 | I/O | Multi-function GPIO/XU316 Internal Clock Output |
|
||||
| 4 | X1D10 | I/O | Multi-function GPIO |
|
||||
| 5 | X1D09 | I/O | Multi-function GPIO |
|
||||
| 6 | X1D01 | I/O | Multi-function GPIO |
|
||||
| 7 | X1D00 | I/O | Multi-function GPIO |
|
||||
| 8 | X0D11 | I/O | Multi-function GPIO |
|
||||
| 9 | X0D00 | I/O | Multi-function GPIO |
|
||||
| 10 | X0D31 | I/O | Multi-function GPIO |
|
||||
| 11 | X0D30 | I/O | Multi-function GPIO |
|
||||
| 12 | X1D34 | I/O | Multi-function GPIO |
|
||||
| 13 | X0D43 | I/O | Multi-function GPIO |
|
||||
| 14 | X0D41 | I/O | Multi-function GPIO |
|
||||
| 15 | X0D42 | I/O | Multi-function GPIO |
|
||||
| 16 | MCLK | I/O | Module 49.152/45.1584MHz Crystal Clock Output |
|
||||
| 17 | X0D40 | I/O | Multi-function GPIO |
|
||||
| 18 | X0D38 | I/O | Multi-function GPIO |
|
||||
| 19 | X0D37 | I/O | Multi-function GPIO |
|
||||
| 20 | X0D36 | I/O | Multi-function GPIO |
|
||||
| 21 | X0D35 | I/O | Multi-function GPIO |
|
||||
| 22 | X0D29 | I/O | Multi-function GPIO |
|
||||
| 23 | X1D22 | I/O | Multi-function GPIO |
|
||||
| 24 | X1D19 | I/O | Multi-function GPIO |
|
||||
| 25 | X1D16 | I/O | Multi-function GPIO |
|
||||
| 26 | USB_DP | I/O | USB_DP |
|
||||
| 27 | USB_DM | I/O | USB_DM |
|
||||
| 28 | X1D18 | I/O | Multi-function GPIO |
|
||||
| 29 | X1D17 | I/O | Multi-function GPIO |
|
||||
| 30 | X1D13 | I/O | Multi-function GPIO |
|
||||
|
||||
## 3. Module Dimensions and PCB Package Graphics
|
||||
### 3.1 Module Dimensions
|
||||
PCB Dimensions: 19.5±0.3(L)X26±0.3(W)X0.8±0.1(H)
|
||||
|
||||
### 3.2 Module Package Diagram
|
||||
<figure markdown="span">
|
||||
{width=300}
|
||||
<figcaption></figcaption>
|
||||
</figure>
|
||||
|
||||
## 4. Product Packaging Information
|
||||
Tray + Outer Box Packaging
|
||||
|
||||
## 5. Recommended Reflow Oven Temperature Curve
|
||||
<figure markdown="span">
|
||||
{width=500}
|
||||
<figcaption></figcaption>
|
||||
</figure>
|
||||
|
||||
## 6. Revision History
|
||||
|
||||
| Version | Date | Description | Revised by |
|
||||
|:------|:-------------|:---------------------------------------|:-------------|
|
||||
| V1.0 | 2023-13-12 | Initial Version Release | |
|
||||
| V1.1 | 2025-05-07 | Removed software-related function descriptions | |
|
||||
| | | | |
|
||||
158
en/docs/dev_doc/datasheet/modules/a316_codec_v1_datasheet.md
Normal file
158
en/docs/dev_doc/datasheet/modules/a316_codec_v1_datasheet.md
Normal file
@@ -0,0 +1,158 @@
|
||||
---
|
||||
title: A316-Codec-V1 Integrated XU316+Codec Microphone-Specific Module Specification Sheet
|
||||
---
|
||||
|
||||
# A316-Codec-V1 Integrated XU316+Codec Microphone-Specific Module Specification Sheet
|
||||
|
||||
--8<-- "common/phaten_xmos_support_img.md"
|
||||
|
||||
<div class="result" markdown>
|
||||
|
||||
{align=right width=250 style="transform: rotate(90deg); margin-top:200px"}
|
||||
|
||||
## 1. Product Introduction
|
||||
### 1.1 Product Description
|
||||
|
||||
- A316-Codec-V1 is a module designed specifically for USB microphone applications, integrating the XMOS XU316 processor and 88L21 high-performance audio codec, providing exceptional audio processing performance.
|
||||
- The module integrates a high-precision DC-DC power circuit, outputting 3.3V, 1.8V, and 0.9V to power the XU316, requiring only a direct 5V power input externally, greatly simplifying the design complexity of the application baseboard.
|
||||
- The module supports both single-ended and differential microphone inputs, and provides stereo audio output, suitable for various audio capture and playback application scenarios.
|
||||
- The module is equipped with a 16Mbit Flash storage for storing audio firmware and system configurations, supporting firmware upgrade functionality.
|
||||
- It provides a USB 2.0 interface, supporting full-speed and high-speed modes, implementing USB Audio device functionality, compatible with multiple operating systems.
|
||||
</div>
|
||||
|
||||
### 1.2 Product Features
|
||||
|
||||
- **USB Interface Features**
|
||||
- USB 2.0 (Full-speed and High-speed modes)
|
||||
- USB Audio Class 1.0/2.0 support
|
||||
- USB Firmware Upgrade (DFU) functionality
|
||||
- Asynchronous transfer mode, reducing clock jitter
|
||||
|
||||
- **Audio Input/Output Capabilities**
|
||||
- Integrated NAU88L21 high-performance audio codec
|
||||
- Supports single-ended and differential microphone inputs
|
||||
- Provides high-quality stereo audio output
|
||||
- Built-in microphone preamplifier
|
||||
- Supports multiple audio interface specifications
|
||||
- 48 KHz/24 bit high-quality audio sampling
|
||||
|
||||
- **System Compatibility**
|
||||
- Supports Windows, Linux, Android, macOS, and iOS operating systems
|
||||
- Plug and play, no additional drivers needed (UAC 2.0 compatible systems)
|
||||
- Applicable to conference systems, gaming headsets, professional recording equipment, and other application scenarios
|
||||
|
||||
### 1.3 Product Block Diagram
|
||||
|
||||
<figure markdown="span">
|
||||
{width="600"}
|
||||
<figcaption>Figure 1: A316-Codec-V1 System Block Diagram</figcaption>
|
||||
</figure>
|
||||
|
||||
### 1.4 Specifications
|
||||
|
||||
| Specification Item | Description |
|
||||
|:---------------------|:--------------------------|
|
||||
| Product Name | A316-Codec-V1 |
|
||||
| Product Description | USB Microphone and Audio Input/Output Module |
|
||||
| Core Processor | XMOS XU316-1024-QF60BC24 |
|
||||
| Audio Codec | NAU88L21 High-Performance Codec |
|
||||
| Package Type | Compatible with SMT and Pin Header |
|
||||
| Environmental Standard | Complies with RoHS Directive |
|
||||
|
||||
### 1.5 Absolute Electrical Parameters
|
||||
| Parameter | Minimum | Maximum | Unit |
|
||||
|:-------------------------------------|:------:|:------:|:----:|
|
||||
| Storage Temperature | -40 | 125 | ℃ |
|
||||
| Supply Voltage | -0.5 | 5.5 | V |
|
||||
| ESD Voltage (Human Model) TAMB-25℃ | -2 | 2 | KV |
|
||||
| ESD Voltage (Machine Model) TAMB-25℃ | -500 | 500 | V |
|
||||
|
||||
|
||||
### 1.6 Normal Operating Conditions
|
||||
| Function | Minimum | Typical | Maximum | Unit |
|
||||
|:---------|:------:|:------:|:------:|:----:|
|
||||
| Operating Temperature | 0 | 25 | 70 | ℃ |
|
||||
| Operating Voltage (Module Input) | 4.75 | 5.0 | 5.25 | V |
|
||||
|
||||
### 1.7 Operating Current
|
||||
|Operation State | Average | Peak | Unit |
|
||||
|:---------|:------:|:------:|:----:|
|
||||
| Active@5.0V | 100 | 150 | mA |
|
||||
|
||||
|
||||
## 2. Pin Definition
|
||||
|
||||
### 2.1 Pin Layout
|
||||
<figure markdown="span">
|
||||
{width=600}
|
||||
<figcaption>Figure 2: A316-Codec-V1 Pin Layout Diagram</figcaption>
|
||||
</figure>
|
||||
|
||||
### 2.2 Pin Description
|
||||
| Pin Number | Name | Type | Function |
|
||||
|:--------:|:----------|:------|:-----------------------------|
|
||||
| 1 | VBUS | P | 5V Power Input |
|
||||
| 2 | GND | P | Module Ground |
|
||||
| 3 | 1V8_O | O | 1.8V Power Output (Debug Only) |
|
||||
| 4 | TDI | I | XTAG Debug PIN |
|
||||
| 5 | TDO | O | XTAG Debug PIN |
|
||||
| 6 | RST | I | System Reset, Active Low (Internal Pull-up)|
|
||||
| 7 | TMS | I/O | XTAG Debug PIN |
|
||||
| 8 | TCK | I | XTAG Debug PIN |
|
||||
| 9 | X1D22 | I/O | Multi-function GPIO |
|
||||
| 10 | 3V3_O | O | 3.3V Power Output (Debug Only) |
|
||||
| 11 | DM | I/O | USB Data Negative |
|
||||
| 12 | DP | I/O | USB Data Positive |
|
||||
| 13 | VBUS | P | 5V Power Input |
|
||||
| 14 | GND | P | Module Ground |
|
||||
| 15 | GND | P | Module Ground |
|
||||
| 16 | VBUS | P | 5V Power Input |
|
||||
| 17 | HP_R | O | Headphone Right Channel Output |
|
||||
| 18 | HP_L | O | Headphone Left Channel Output |
|
||||
| 19 | X0D33 | I/O | Multi-function GPIO |
|
||||
| 20 | X0D32 | I/O | Multi-function GPIO |
|
||||
| 21 | X0D31 | I/O | Multi-function GPIO |
|
||||
| 22 | X0D30 | I/O | Multi-function GPIO |
|
||||
| 23 | X0D43 | I/O | Multi-function GPIO |
|
||||
| 24 | X0D41 | I/O | Multi-function GPIO |
|
||||
| 25 | X0D42 | I/O | Multi-function GPIO |
|
||||
| 26 | MIC_BIAS | O | Microphone Bias Voltage Output |
|
||||
| 27 | MIC_P | I | Microphone Positive Input |
|
||||
| 28 | MIC_N | I | Microphone Negative Input |
|
||||
|
||||
*Note: I/O Type Definitions in Table: I=Input, O=Output, P=Power, I/O=Input/Output*
|
||||
|
||||
## 3. Module Dimensions and PCB Package Graphics
|
||||
### 3.1 Module Dimensions
|
||||
PCB Dimensions: 18.0±0.2(L)X35.16±0.2(W)X1.0±0.1(H) mm
|
||||
|
||||
### 3.2 Module Package Diagram
|
||||
<figure markdown="span">
|
||||
{width=600}
|
||||
<figcaption>Figure 3: A316-Codec-V1 Package Dimension Diagram</figcaption>
|
||||
</figure>
|
||||
|
||||
## 4. Typical Application Schematic
|
||||
|
||||
<figure markdown="span">
|
||||
{width=600}
|
||||
<figcaption>Figure 4: A316-Codec-V1 Typical Application Schematic</figcaption>
|
||||
</figure>
|
||||
|
||||
This schematic shows the typical connection method of the A316-Codec-V1 module in a USB microphone application. The module connects to the host device (such as a computer or phone) via the USB interface, enabling bidirectional transmission of digital audio. Externally, only a 5V power input is required, and the DC-DC power management circuit inside the module automatically converts it to the working voltages required by the XU316 and 88L21. The microphone input port supports connecting single-ended or differential microphones, and the stereo output can be connected to headphones. The integrated high-performance codec ensures audio quality while simplifying external circuit design.
|
||||
|
||||
## 5. Product Packaging Information
|
||||
Tray + Outer Box Packaging
|
||||
|
||||
## 6. Recommended Reflow Oven Temperature Curve
|
||||
<figure markdown="span">
|
||||
{width=600}
|
||||
<figcaption>Figure 5: Recommended Reflow Oven Temperature Curve</figcaption>
|
||||
</figure>
|
||||
|
||||
|
||||
## 6. Revision History
|
||||
| Version | Date | Description | Revised by |
|
||||
|:------|:-------------|:---------------------------------------|:-------------|
|
||||
| V1.0 | 2025-05-07 | Initial Version Release | |
|
||||
| | | | |
|
||||
163
en/docs/dev_doc/datasheet/modules/a316_mini_v1_datasheet.md
Normal file
163
en/docs/dev_doc/datasheet/modules/a316_mini_v1_datasheet.md
Normal file
@@ -0,0 +1,163 @@
|
||||
---
|
||||
title: A316-Mini-V1 Ultra-small XU316 Module Specification Sheet
|
||||
---
|
||||
|
||||
# A316-Mini-V1 Ultra-small XU316 Module Specification Sheet
|
||||
|
||||
--8<-- "common/phaten_xmos_support_img.md"
|
||||
|
||||
<div class="result" markdown>
|
||||
{align=right width=150}
|
||||
## 1. Product Introduction
|
||||
### 1.1 Product Description
|
||||
|
||||
**A316-Mini-V1** is an ultra-small XU316 module based on the XMOS XU316-1024-QF60BC24 chip. Core features:
|
||||
|
||||
- **Ultra-compact Design**: Size only 13×13mm, just 6mm larger than the chip itself (7×7mm)
|
||||
- **High Integration**: Built-in 24MHz crystal and 16Mbit firmware storage Flash
|
||||
- **High-performance Audio**: Supports USB 2.0 full-speed/high-speed interface, with sampling rates up to 768kHz in asynchronous mode
|
||||
- **Application Flexibility**: Supports various high-definition audio decoding needs by changing firmware
|
||||
|
||||
Suitable for high-end audio system designs with space constraints.
|
||||
</div>
|
||||
|
||||
### 1.2 Product Features
|
||||
|
||||
- **USB Interface Features**
|
||||
- USB 2.0 (Full-speed and High-speed)
|
||||
- USB Audio Class 1.0
|
||||
- USB Audio Class 2.0
|
||||
- USB Firmware Upgrade (DFU)
|
||||
|
||||
### 1.3 Product Diagram
|
||||
|
||||
<figure markdown="span">
|
||||
{width="600"}
|
||||
<figcaption></figcaption>
|
||||
</figure>
|
||||
|
||||
### 1.4 Specifications
|
||||
|
||||
| Specification Item | Description
|
||||
| :------------------------| :----------
|
||||
| Product Name | A316-Mini-V1
|
||||
| Product Description | Ultra-small XU316 Module
|
||||
| Core Chip |[XMOS XU316-1024-QF60B-C24](/assets/download/XMOS-XU316-1024-QF60B-C24.pdf)|
|
||||
| Package Type | SMT LGA
|
||||
| Environmental Statement | All hardware components fully comply with EU RoHS directive
|
||||
|
||||
### 1.5 Absolute Electrical Parameters
|
||||
| Parameter | Minimum | Maximum | Unit |
|
||||
|:-------------------------------------|:------:|:------:|:----:|
|
||||
| Storage Temperature | -40 | 125 | ℃ |
|
||||
| Supply Voltage | -0.5 | 3.63 | V |
|
||||
| 1.8V Supply Voltage | -0.5 | 1.98 | V |
|
||||
| 0.9V Supply Voltage | -0.5 | 1.05 | V |
|
||||
| ESD Voltage (Human Model) TAMB-25℃ | -2 | 2 | KV |
|
||||
| ESD Voltage (Machine Model) TAMB-25℃ | -500 | 500 | V |
|
||||
|
||||
|
||||
### 1.6 Normal Operating Conditions
|
||||
| Function | Minimum | Typical | Maximum | Unit |
|
||||
|:-------------|:------: |:------:|:------:|:----:|
|
||||
| Operating Temperature | 0 | - | 70 | ℃ |
|
||||
| Operating Voltage | 3.0 | 3.3 | 3.6 | V |
|
||||
| 1.8V Operating Voltage | 1.62 | 1.80 | 1.98 | V |
|
||||
| 0.9V Operating Voltage | 0.855 | 0.90 | 0.945 | V |
|
||||
|
||||
### 1.7 Operating Current
|
||||
|Operation State | Average | Peak | Unit |
|
||||
|:---------|:------:|:------:|:----:|
|
||||
| Active@3.3V | 7 | 25 | mA |
|
||||
| Active@1.8V | 30 | 36 | mA |
|
||||
| Active@0.9V | 300 | 1000 | mA |
|
||||
|
||||
|
||||
## 2. Pin Definition
|
||||
|
||||
### 2.1 Pin Layout
|
||||
<figure markdown="span">
|
||||
{width=400}
|
||||
<figcaption></figcaption>
|
||||
</figure>
|
||||
|
||||
### 2.2 Pin Description
|
||||
| Module Pin Number | Name | Type | Function |
|
||||
| :------: | :------: | :------: | :------ |
|
||||
| 1 | 3.3V | P | Module 3.3V Power Supply |
|
||||
| 2 | X1D13 | I/O | Multi-function GPIO |
|
||||
| 3 | X1D16 | I/O | Multi-function GPIO |
|
||||
| 4 | GND | P | Module Ground |
|
||||
| 5 | X1D17 | I/O | Multi-function GPIO |
|
||||
| 6 | X1D18 | I/O | Multi-function GPIO |
|
||||
| 7 | X1D19 | I/O | Multi-function GPIO |
|
||||
| 8 | X1D22 | I/O | Multi-function GPIO |
|
||||
| 9 | X0D29 | I/O | Multi-function GPIO |
|
||||
| 10 | X0D35 | I/O | Multi-function GPIO |
|
||||
| 11 | X0D36 | I/O | Multi-function GPIO |
|
||||
| 12 | X0D37 | I/O | Multi-function GPIO |
|
||||
| 13 | X0D38 | I/O | Multi-function GPIO |
|
||||
| 14 | X0D40 | I/O | Multi-function GPIO |
|
||||
| 15 | X0D39 | I/O | Multi-function GPIO |
|
||||
| 16 | X0D42 | I/O | Multi-function GPIO |
|
||||
| 17 | X0D41 | I/O | Multi-function GPIO |
|
||||
| 18 | X0D43 | I/O | Multi-function GPIO |
|
||||
| 19 | X1D34 | I/O | Multi-function GPIO |
|
||||
| 20 | GND | P | Module Ground |
|
||||
| 21 | X0D30 | I/O | Multi-function GPIO |
|
||||
| 22 | X0D31 | I/O | Multi-function GPIO |
|
||||
| 23 | X0D32 | I/O | Multi-function GPIO |
|
||||
| 24 | X0D32 | I/O | Multi-function GPIO |
|
||||
| 25 | GND | P | Module Ground |
|
||||
| 26 | GND | P | Module Ground |
|
||||
| 27 | GND | P | Module Ground |
|
||||
| 28 | X0D00 | I/O | Multi-function GPIO |
|
||||
| 29 | X0D11 | I/O | Multi-function GPIO |
|
||||
| 30 | X1D00 | I/O | Multi-function GPIO |
|
||||
| 31 | X1D01 | I/O | Multi-function GPIO |
|
||||
| 32 | GND | P | Module Ground |
|
||||
| 33 | X1D09 | I/O | Multi-function GPIO |
|
||||
| 34 | X1D10 | I/O | Multi-function GPIO |
|
||||
| 35 | X1D11 | I/O | Multi-function GPIO/XU316 Internal Clock Output |
|
||||
| 36 | GND | P | Module Ground |
|
||||
| 37 | GND | P | Module Ground |
|
||||
| 38 | TDI | I/O | Multi-function GPIO |
|
||||
| 39 | TDO | I/O | Multi-function GPIO |
|
||||
| 40 | TMS | I/O | Multi-function GPIO |
|
||||
| 41 | TCK | I/O | Multi-function GPIO |
|
||||
| 42 | RST_N | I/O | Multi-function GPIO |
|
||||
| 43 | 1.8V | P | Module 1.8V Power Supply |
|
||||
| 44 | GND | P | Module Ground |
|
||||
| 45 | USB_DM | I/O | USB_DM |
|
||||
| 46 | USB_DP | I/O | USB_DP |
|
||||
| 47 | GND | P | Module Ground |
|
||||
| 48 | 0.9V | P | Module 0.9V Power Supply |
|
||||
| 49 | GND | P | Module Ground |
|
||||
| 50 | GND | P | Module Ground |
|
||||
| 51 | GND | P | Module Ground |
|
||||
| 52 | GND | P | Module Ground |
|
||||
|
||||
## 3. Module Dimensions and PCB Package Graphics
|
||||
### 3.1 Module Dimensions
|
||||
PCB Dimensions: 13±0.1(L)X13±0.1(W)X0.8±0.1(H)
|
||||
|
||||
### 3.2 Module Package Diagram
|
||||
<figure markdown="span">
|
||||
{width=400}
|
||||
<figcaption></figcaption>
|
||||
</figure>
|
||||
|
||||
## 4. Product Packaging Information
|
||||
Tray + Outer Box Packaging
|
||||
|
||||
## 5. Recommended Reflow Oven Temperature Curve
|
||||
<figure markdown="span">
|
||||
{width=500}
|
||||
<figcaption></figcaption>
|
||||
</figure>
|
||||
|
||||
## 6. Revision History
|
||||
| Version | Date | Description | Revised by |
|
||||
|:------|:-------------|:---------------------------------------|:-------------|
|
||||
| V1.0 | 2025-05-07 | Initial Version Release | |
|
||||
| | | | |
|
||||
Reference in New Issue
Block a user